IOL's high power diode laser single emitter based modules by adopting specialized die-bonding, wire-bonding and fiber coupling techniques, inspection and burn-in procedures in each precedure, result in volume products with high efficiency, high stability, high reliability, superior beam quality and long lifetime. IOL's products family consists of Chip-on-Carrier (C and Q mount), fiber coupled (TO3, BF4 and TO220) and combined power module (CPM) packages, providing state-of-the-art power and brightness. The products are available in wavelength from 790nm to 980nm, power from 100mW to 30W out of 50um to 600um fiber. IOL's constantly improving and innovating the processing technology and continuously developing new products to meet customer's specific requirements.
 
Features:
AuSn bonding;
High PCE;
Sealed packaging;
Custom wavelengths and powers available.
 
Applications:
Microlaser pumping;
Material processing;
Medical therapeutics;
Graphic arts; Heating;
Illumination.